Ieee Transactions On Software Engineering SCIE

國際簡稱：IEEE T SOFTWARE ENG 參考譯名：IEEE軟件工程匯刊

主要研究方向：工程技術(shù)-工程：電子與電氣非預(yù)警期刊審稿周期：約6.0個(gè)月

《IEEE軟件工程匯刊》(Ieee Transactions On Software Engineering)是一本由Institute of Electrical and Electronics Engineers Inc.出版的以工程技術(shù)-工程：電子與電氣為研究特色的國際期刊，發(fā)表該領(lǐng)域相關(guān)的原創(chuàng)研究文章、評(píng)論文章和綜述文章，及時(shí)報(bào)道該領(lǐng)域相關(guān)理論、實(shí)踐和應(yīng)用學(xué)科的最新發(fā)現(xiàn)，旨在促進(jìn)該學(xué)科領(lǐng)域科學(xué)信息的快速交流。該期刊是一本未開放期刊，近三年沒有被列入預(yù)警名單。該期刊享有很高的科學(xué)聲譽(yù)，影響因子不斷增加，發(fā)行量也同樣高。

1區(qū) 中科院分區(qū)
Q1 JCR分區(qū)
271 年發(fā)文量
6.5 IF影響因子
未開放 是否OA
151 H-index
1975 創(chuàng)刊年份
Bimonthly 出版周期
English 出版語言

The IEEE Transactions on Software Engineering is interested in well-defined theoretical results and empirical studies that have potential impact on the construction, analysis, or management of software. The scope of this Transactions ranges from the mechanisms through the development of principles to the application of those principles to specific environments. Specific topic areas include: a) development and maintenance methods and models, e.g., techniques and principles for the specification, design, and implementation of software systems, including notations and process models; b) assessment methods, e.g., software tests and validation, reliability models, test and diagnosis procedures, software redundancy and design for error control, and the measurements and evaluation of various aspects of the process and product; c) software project management, e.g., productivity factors, cost models, schedule and organizational issues, standards; d) tools and environments, e.g., specific tools, integrated tool environments including the associated architectures, databases, and parallel and distributed processing issues; e) system issues, e.g., hardware-software trade-off; and f) state-of-the-art surveys that provide a synthesis and comprehensive review of the historical development of one particular area of interest.

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Ieee Transactions On Software Engineering期刊信息

ISSN：0098-5589
出版語言：English
是否OA：未開放
E-ISSN：1939-3520
出版地區(qū)：UNITED STATES
是否預(yù)警：否
出版商：Institute of Electrical and Electronics Engineers Inc.
出版周期：Bimonthly
創(chuàng)刊時(shí)間：1975
開源占比：0.1292
Gold OA文章占比：18.37%
OA被引用占比：0
出版國人文章占比：0.12
出版撤稿占比：0
研究類文章占比：98.52%

Ieee Transactions On Software Engineering CiteScore評(píng)價(jià)數(shù)據(jù)（2024年最新版）

CiteScore

SJR

SNIP

CiteScore 指數(shù)

9.7

1.868

2.591

學(xué)科類別	分區(qū)	排名	百分位
大類：Computer Science 小類：Software	Q1	60 / 407	85%

名詞解釋：CiteScore 是衡量期刊所發(fā)表文獻(xiàn)的平均受引用次數(shù)，是在 Scopus 中衡量期刊影響力的另一個(gè)指標(biāo)。當(dāng)年CiteScore 的計(jì)算依據(jù)是期刊最近4年（含計(jì)算年度）的被引次數(shù)除以該期刊近四年發(fā)表的文獻(xiàn)數(shù)。例如，2022年的 CiteScore 計(jì)算方法為：2022年的 CiteScore =2019-2022年收到的對(duì)2019-2022年發(fā)表的文件的引用數(shù)量÷2019-2022年發(fā)布的文獻(xiàn)數(shù)量注：文獻(xiàn)類型包括：文章、評(píng)論、會(huì)議論文、書籍章節(jié)和數(shù)據(jù)論文。

Ieee Transactions On Software Engineering中科院評(píng)價(jià)數(shù)據(jù)

中科院 2023年12月升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
是	否	計(jì)算機(jī)科學(xué)	1區(qū)	COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī)：軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	1區(qū) 1區(qū)

中科院 2022年12月升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
是	否	計(jì)算機(jī)科學(xué)	1區(qū)	COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī)：軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	1區(qū) 1區(qū)

中科院 2021年12月舊的升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
是	否	計(jì)算機(jī)科學(xué)	1區(qū)	COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī)：軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	1區(qū) 1區(qū)

中科院 2021年12月基礎(chǔ)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
是	否	工程技術(shù)	2區(qū)	COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī)：軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	1區(qū) 2區(qū)

中科院 2021年12月升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
是	否	計(jì)算機(jī)科學(xué)	1區(qū)	COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī)：軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	1區(qū) 1區(qū)

中科院 2020年12月舊的升級(jí)版

Top期刊	綜述期刊	大類學(xué)科		小類學(xué)科
是	否	計(jì)算機(jī)科學(xué)	1區(qū)	COMPUTER SCIENCE, SOFTWARE ENGINEERING 計(jì)算機(jī)：軟件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣	1區(qū) 1區(qū)

Ieee Transactions On Software Engineering JCR評(píng)價(jià)數(shù)據(jù)（2023-2024年最新版）

按JIF指標(biāo)學(xué)科分區(qū)	收錄子集	分區(qū)	排名	百分位
學(xué)科：COMPUTER SCIENCE, SOFTWARE ENGINEERING	SCIE	Q1	9 / 131	93.5%
學(xué)科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q1	40 / 352	88.8%

按JCI指標(biāo)學(xué)科分區(qū)	收錄子集	分區(qū)	排名	百分位
學(xué)科：COMPUTER SCIENCE, SOFTWARE ENGINEERING	SCIE	Q1	6 / 131	95.8%
學(xué)科：ENGINEERING, ELECTRICAL & ELECTRONIC	SCIE	Q1	19 / 354	94.77%

Ieee Transactions On Software Engineering歷年數(shù)據(jù)統(tǒng)計(jì)

影響因子

中科院分區(qū)

Ieee Transactions On Software Engineering中國學(xué)者發(fā)文選摘

1、A Large-Scale Empirical Study of Real-Life Performance Issues in Open Source Projects
Author: Zhao, Yutong; Xiao, Lu; Bondi, Andre B.; Chen, Bihuan; Liu, Yang

Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 924-946. DOI: 10.1109/TSE.2022.3167628
2、Pull Request Decisions Explained: An Empirical Overview
Author: Zhang, Xunhui; Yu, Yue; Gousios, Georgios; Rastogi, Ayushi

Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 849-871. DOI: 10.1109/TSE.2022.3165056
3、Web APIs: Features, Issues, and Expectations - A Large-Scale Empirical Study of Web APIs From Two Publicly Accessible Registries Using Stack Overflow and a User Survey
Author: Zhang, Neng; Zou, Ying; Xia, Xin; Huang, Qiao; Lo, David; Li, Shanping

Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 498-528. DOI: 10.1109/TSE.2022.3154769
4、ErrHunter: Detecting Error-Handling Bugs in the Linux Kernel Through Systematic Static Analysis
Author: Zhan, Dongyang; Yu, Xiangzhan; Zhang, Hongli; Ye, Lin

Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 684-698. DOI: 10.1109/TSE.2022.3160155
5、Off to a Good Start: Dynamic Contribution Patterns and Technical Success in an OSS Newcomer's Early Career
Author: Yue, Yang; Wang, Yi; Redmiles, David

Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 529-548. DOI: 10.1109/TSE.2022.3156071
6、A Procedure to Continuously Evaluate Predictive Performance of Just-In-Time Software Defect Prediction Models During Software Development
Author: Song, Liyan; Minku, Leandro L.

Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 646-666. DOI: 10.1109/TSE.2022.3158831
7、Inconsistent Defect Labels: Essence, Causes, and Influence
Author: Liu, Shiran; Guo, Zhaoqiang; Li, Yanhui; Wang, Chuanqi; Chen, Lin; Sun, Zhongbin; Zhou, Yuming; Xu, Baowen

Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 586-610. DOI: 10.1109/TSE.2022.3156787
8、Large-Scale Empirical Study of Inline Assembly on 7.6 Million Ethereum Smart Contracts
Author: Liao, Zhou; Song, Shuwei; Zhu, Hang; Luo, Xiapu; He, Zheyuan; Jiang, Renkai; Chen, Ting; Chen, Jiachi; Zhang, Tao; Zhang, Xiaosong

Journal: IEEE TRANSACTIONS ON SOFTWARE ENGINEERING. 2023; Vol. 49, Issue 2, pp. 777-801. DOI: 10.1109/TSE.2022.3163614