同大類學(xué)科其它級別期刊:
中科院 1區(qū) 期刊 JCR Q1 期刊 中科院 2區(qū) 期刊 JCR Q2 期刊 中科院 3區(qū) 期刊 JCR Q3 期刊 中科院 4區(qū) 期刊 JCR Q4 期刊國際簡稱:IEEE T VLSI SYST 參考譯名:超大規(guī)模集成 (vlsi) 系統(tǒng)上的 Ieee 事務(wù)
主要研究方向:工程技術(shù)-工程:電子與電氣 非預(yù)警期刊 審稿周期: 一般,3-6周
《超大規(guī)模集成 (vlsi) 系統(tǒng)上的 Ieee 事務(wù)》(Ieee Transactions On Very Large Scale Integration (vlsi) Systems)是一本由Institute of Electrical and Electronics Engineers Inc.出版的以工程技術(shù)-工程:電子與電氣為研究特色的國際期刊,發(fā)表該領(lǐng)域相關(guān)的原創(chuàng)研究文章、評論文章和綜述文章,及時報道該領(lǐng)域相關(guān)理論、實踐和應(yīng)用學(xué)科的最新發(fā)現(xiàn),旨在促進該學(xué)科領(lǐng)域科學(xué)信息的快速交流。該期刊是一本未開放期刊,近三年沒有被列入預(yù)警名單。該期刊享有很高的科學(xué)聲譽,影響因子不斷增加,發(fā)行量也同樣高。
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
CiteScore | SJR | SNIP | CiteScore 指數(shù) | ||||||||||||||||
6.4 | 0.937 | 1.516 |
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名詞解釋:CiteScore 是衡量期刊所發(fā)表文獻的平均受引用次數(shù),是在 Scopus 中衡量期刊影響力的另一個指標。當(dāng)年CiteScore 的計算依據(jù)是期刊最近4年(含計算年度)的被引次數(shù)除以該期刊近四年發(fā)表的文獻數(shù)。例如,2022年的 CiteScore 計算方法為:2022年的 CiteScore =2019-2022年收到的對2019-2022年發(fā)表的文件的引用數(shù)量÷2019-2022年發(fā)布的文獻數(shù)量 注:文獻類型包括:文章、評論、會議論文、書籍章節(jié)和數(shù)據(jù)論文。
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 工程技術(shù) | 2區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 2區(qū) 3區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 工程技術(shù) | 2區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) 3區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 工程技術(shù) | 3區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) 3區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 工程技術(shù) | 4區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 4區(qū) 4區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 工程技術(shù) | 3區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) 3區(qū) |
Top期刊 | 綜述期刊 | 大類學(xué)科 | 小類學(xué)科 | ||
否 | 否 | 工程技術(shù) | 2區(qū) | COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 計算機:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:電子與電氣 | 3區(qū) 3區(qū) |
按JIF指標學(xué)科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
學(xué)科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q2 | 23 / 59 |
61.9% |
學(xué)科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 151 / 352 |
57.2% |
按JCI指標學(xué)科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
學(xué)科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE | SCIE | Q2 | 26 / 59 |
56.78% |
學(xué)科:ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 149 / 354 |
58.05% |
Author: Bai, Fujun; Wang, Song; Jia, Xuerong; Guo, Yixin; Yu, Bing; Wang, Hang; Lai, Cong; Ren, Qiwei; Sun, Hongbin
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 128-141. DOI: 10.1109/TVLSI.2022.3219437
Author: Ren, Qirui; Huo, Qiang; Chen, Zhisheng; Gao, Qi; Wang, Yiming; Yang, Yiming; Wu, Hao; Fu, Xiangqu; Xu, Xiaoxin; Luo, Qing; Gao, Jianfeng; Chen, Chengying; Zhao, Xiaojin; Lei, Dengyun; Wang, Xinghua; Zhang, Feng; Chen, Yong; Mak, Pui-In
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 243-252. DOI: 10.1109/TVLSI.2022.3222522
Author: Wang, Yujia; Zhang, Jincheng; Chen, Yong; Ren, Junyan; Ma, Shunli
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 233-242. DOI: 10.1109/TVLSI.2022.3225967
Author: Wang, Jun; Luo, Yuhuan; Guo, Wenting; Wu, Feng; Chu, Xiuqin
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 210-218. DOI: 10.1109/TVLSI.2022.3225533
Author: Tan, Hongbing; Tong, Gan; Huang, Libo; Xiao, Liquan; Xiao, Nong
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 2, pp. 253-266. DOI: 10.1109/TVLSI.2022.3226185
Author: Qiu, Lei; Meng, Tianyi; Yao, Bingbing; Du, Zihao; Yuan, Xiaohua
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 152-156. DOI: 10.1109/TVLSI.2022.3224237
Author: Li, Hongyan; Lu, Hang; Wang, Haoxuan; Deng, Shengji; Li, Xiaowei
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 90-103. DOI: 10.1109/TVLSI.2022.3221732
Author: Gao, Zhen; Shi, Jinchang; Liu, Qiang; Ullah, Anees; Reviriego, Pedro
Journal: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. 2023; Vol. 31, Issue 1, pp. 142-146. DOI: 10.1109/TVLSI.2022.3224137
Applied Thermal Engineering
中科院 2區(qū) JCR Q1
Thermal Science And Engineering Progress
中科院 3區(qū) JCR Q1
Acta Geotechnica
中科院 1區(qū) JCR Q1
Separation And Purification Technology
中科院 1區(qū) JCR Q1
Ieee Transactions On Industrial Electronics
中科院 1區(qū) JCR Q1
Engineering Letters
中科院 4區(qū) JCR Q4
Review Of Scientific Instruments
中科院 4區(qū) JCR Q3
International Journal Of Thermal Sciences
中科院 2區(qū) JCR Q1
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