Journal Of Micromechanics And Microengineering SCIE
國際簡稱：J MICROMECH MICROENG 參考譯名：微機械與微工程雜志
主要研究方向：工程技術(shù)-材料科學：綜合 非預警期刊 審稿周期： 約2.8個月
《微機械與微工程雜志》(Journal Of Micromechanics And Microengineering)是一本由IOP Publishing Ltd.出版的以工程技術(shù)-材料科學：綜合為研究特色的國際期刊，發(fā)表該領域相關(guān)的原創(chuàng)研究文章、評論文章和綜述文章，及時報道該領域相關(guān)理論、實踐和應用學科的最新發(fā)現(xiàn)，旨在促進該學科領域科學信息的快速交流。該期刊是一本未開放期刊，近三年沒有被列入預警名單。
- 4區(qū) 中科院分區(qū)
- Q2 JCR分區(qū)
- 137 年發(fā)文量
- 2.4 IF影響因子
- 未開放 是否OA
- 119 H-index
- 1991 創(chuàng)刊年份
- Monthly 出版周期
- English 出版語言
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.
Journal Of Micromechanics And Microengineering期刊信息
- ISSN：0960-1317
- 出版語言：English
- 是否OA：未開放
- E-ISSN：1361-6439
- 出版地區(qū)：ENGLAND
- 是否預警：否
- 出版商：IOP Publishing Ltd.
- 出版周期：Monthly
- 創(chuàng)刊時間：1991
- 開源占比：0.0884
- Gold OA文章占比：13.91%
- OA被引用占比：0.0241...
- 出版國人文章占比：0.31
- 出版撤稿占比：0
- 研究類文章占比：95.62%
Journal Of Micromechanics And Microengineering CiteScore評價數(shù)據(jù)（2024年最新版）
| CiteScore | SJR | SNIP | CiteScore 指數(shù) | ||||||||||||||||||||
| 4.5 | 0.476 | 0.789 |
|
名詞解釋：CiteScore 是衡量期刊所發(fā)表文獻的平均受引用次數(shù)，是在 Scopus 中衡量期刊影響力的另一個指標。當年CiteScore 的計算依據(jù)是期刊最近4年（含計算年度）的被引次數(shù)除以該期刊近四年發(fā)表的文獻數(shù)。例如，2022年的 CiteScore 計算方法為：2022年的 CiteScore =2019-2022年收到的對2019-2022年發(fā)表的文件的引用數(shù)量÷2019-2022年發(fā)布的文獻數(shù)量 注：文獻類型包括：文章、評論、會議論文、書籍章節(jié)和數(shù)據(jù)論文。
Journal Of Micromechanics And Microengineering中科院評價數(shù)據(jù)
中科院 2023年12月升級版
| Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
| 否 | 否 | 工程技術(shù) | 4區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應用 | 4區(qū) 4區(qū) 4區(qū) 4區(qū) |
中科院 2022年12月升級版
| Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
| 否 | 否 | 工程技術(shù) | 4區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應用 | 4區(qū) 4區(qū) 4區(qū) 4區(qū) |
中科院 2021年12月舊的升級版
| Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
| 否 | 否 | 工程技術(shù) | 4區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應用 | 4區(qū) 4區(qū) 4區(qū) 4區(qū) |
中科院 2021年12月基礎版
| Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
| 否 | 否 | 工程技術(shù) | 4區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應用 | 4區(qū) 4區(qū) 4區(qū) 4區(qū) |
中科院 2021年12月升級版
| Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
| 否 | 否 | 工程技術(shù) | 4區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應用 | 4區(qū) 4區(qū) 4區(qū) 4區(qū) |
中科院 2020年12月舊的升級版
| Top期刊 | 綜述期刊 | 大類學科 | 小類學科 | ||
| 否 | 否 | 工程技術(shù) | 4區(qū) | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 INSTRUMENTS & INSTRUMENTATION 儀器儀表 NANOSCIENCE & NANOTECHNOLOGY 納米科技 PHYSICS, APPLIED 物理：應用 | 4區(qū) 4區(qū) 4區(qū) 4區(qū) |
Journal Of Micromechanics And Microengineering JCR評價數(shù)據(jù)（2023-2024年最新版）
| 按JIF指標學科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
| 學科：ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q2 | 170 / 352 |
51.8% |
| 學科：INSTRUMENTS & INSTRUMENTATION | SCIE | Q2 | 29 / 76 |
62.5% |
| 學科：NANOSCIENCE & NANOTECHNOLOGY | SCIE | Q3 | 102 / 140 |
27.5% |
| 學科：PHYSICS, APPLIED | SCIE | Q3 | 96 / 179 |
46.6% |
| 按JCI指標學科分區(qū) | 收錄子集 | 分區(qū) | 排名 | 百分位 |
| 學科：ENGINEERING, ELECTRICAL & ELECTRONIC | SCIE | Q3 | 200 / 354 |
43.64% |
| 學科：INSTRUMENTS & INSTRUMENTATION | SCIE | Q3 | 46 / 76 |
40.13% |
| 學科：NANOSCIENCE & NANOTECHNOLOGY | SCIE | Q3 | 82 / 140 |
41.79% |
| 學科：PHYSICS, APPLIED | SCIE | Q3 | 106 / 179 |
41.06% |
Journal Of Micromechanics And Microengineering歷年數(shù)據(jù)統(tǒng)計
影響因子
中科院分區(qū)
Journal Of Micromechanics And Microengineering中國學者發(fā)文選摘
-
1、Loss mechanisms of multi-frequency whispering gallery mode RF-MEMS resonators
Author: Liu, Wenli; Chen, Zeji; Lu, Yujie; Zhao, Junyuan; Zhu, Yinfang; Yang, Jinling; Yang, Fuhua
Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/ac8bde
-
2、Remote actuation based on magnetically responsive pillar arrays
Author: Jiang, Wei; Wang, Lanlan; Chen, Bangdao; Liu, Hongzhong
Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 1, pp. -. DOI: 10.1088/1361-6439/aca20f
-
3、Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors
Author: Zhang, Yunfan; Wu, Kangkang; Shen, Shengnan; Zhang, Quanyong; Cao, Wan; Liu, Sheng
Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca913
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4、Topology optimization design of compliant amplification mechanisms with low parasitic displacement
Author: Wang, Qiliang; Wei, Jianming; Long, Yiping; Tan, Jianping
Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 2, pp. -. DOI: 10.1088/1361-6439/aca4dc
-
5、An ionic pressure sensor array with digitizable sensitivity
Author: Zou, Qiang; Liu, Chenyu; Su, Qi; Xue, Tao
Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc873
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6、Identification and suppression of driving force misalignment angle for a MEMS gyroscope using parametric excitation
Author: Zheng, Xudong; Wang, Xuetong; Shen, Yaojie; Xia, Chenhao; Tong, Wenyuan; Jin, Zhonghe; Ma, Zhipeng
Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc6
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7、Research on high temperature performance of pressure sensor
Author: Zhao, Zhiqiang; Pan, Shuliang; Memon, Maria Muzamil; Liu, Qiong; Wang, Tao; Zhang, Wanli
Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acc6dd
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8、Developing a multi-sample acoustofluidic device for high-throughput cell aggregation
Author: Yang, Renhua; Huang, Siping; Zhang, Yiwen; Zhang, Chao; Qian, Jingui; Lam, Raymond H. W.; Lee, Joshua E-Y; Wang, Zuankai
Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2023; Vol. 33, Issue 5, pp. -. DOI: 10.1088/1361-6439/acbfc5
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